F619P2-RC1

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8 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket P (LGA 3647) supports  Intel® Xeon® Scalable Processors,  Dual UPI up to 10.4GT/s 2. Up to 1.5TB ECC 3DS LRDIMM, up to  DDR4-2666MHz; 12 DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP)  1 PCI-E 3.0 x16 (for SIOM ) 4. 6 Hot-swap 2.5" SAS3/SATA3 or 2  Hot-swap 2.5" SAS3/SATA3 +  4 optional NVMe U.2  M.2 Interface: PCI-E 3.0 x4  M.2 Form Factor: 2260, 2280, 22110  M.2 Key: M-Key 5. SAS3 via Broadcom 3108, HW RAID 6. SIOM Network card,  1 dedicated IPMI LAN port 7. 1 VGA, 2 USB 3.0 ports 8. 3x 4cm 20k RPM middle fans 9. 2200W Redundant Power Supplies  Titanium Level (96% Efficiency)