当前位置：首页>产品中心

X11SPi-TF

    1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W
    2. Intel® C622 chipset
    3. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
    4. Expansion slots:
      1 PCI-E 3.0 x16,
      1 PCI-E 3.0 x16 (x16 || x8),
      1 PCI-E 3.0 x8 (x0 || x8),
      1 PCI-E 3.0 x8,
      1 PCI-E 3.0 x4 (in x8)
    5. 2 10GbE LAN ports
    6. 10 SATA3 (6Gbps) via C622
    7. I/O: 1 VGA, 2 COM, TPM header
    8. 2 SuperDOM with built-in power
    9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
    10. M.2 NGFF connector
      M.2 Interface: PCI-E 3.0 x4 and SATA
      Form Factor: 2280, 22110
      Key: M-Key
      Double Height Connector