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X11SPM-TPF

    1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
    2. Intel® C622 chipset
    3. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
    4. Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)
    5. 2 10G SFP+
    6. 12 SATA3 (6Gbps) via C622
    7. Supports 12V DC power input
    8. I/O: 1 VGA, 2 COM, 1 TPM header
    9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
    10. M.2 NGFF connector
      M.2 Interface: PCI-E 3.0 x4
      Form Factor: 2242, 2280
      Key: M-Key
      Double Height Connector