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X11SPH-nCTPF

    1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W
    2. Intel® C622 chipset
    3. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
    4. Expansion slots:
      1 PCI-E 3.0 x16 (x16 || x8),
      1 PCI-E 3.0 x8 (x0 || x8),
      1 PCI-E 3.0 x8,
      1 PCI-E 3.0 x4 (in x8)
    5. 2 10G SFP+
    6. 10 SATA3 (6Gbps) via C622
    7. 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
    8. 2x Port NVMe PCI-E 3.0 x4 via OCuLink
    9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
    10. M.2 NGFF connector
      M.2 Interface: PCI-E 3.0 x4 and SATA
      Form Factor: 2280
      Key: M-Key
      Double Height Connector