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Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205WIntel® C622 chipsetUp to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slotsExpansion slots: 1 PCI-E 3.0 x16 (x16 || x8),
 1 PCI-E 3.0 x8 (x0 || x8),
 1 PCI-E 3.0 x8,
 1 PCI-E 3.0 x4 (in x8)
2 10GbE LAN ports10 SATA3 (6Gbps) via C6228 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 102x Port NVMe PCI-E 3.0 x4 via OCuLink5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)M.2 NGFF connectorM.2 Interface: PCI-E 3.0 x4 and SATA
 Form Factor: 2280
 Key: M-Key
 Double Height Connector
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