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X11SPL-F

    1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W
    2. Intel® C621 Chipset
    3. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
    4. Expansion slots:
      2 PCI-E 3.0 x8 (in x16),
      4 PCI-E 3.0 x8,
      1 PCI-E 3.0 x4 (in x8)
    5. 2 GbE LAN ports
    6. 8 SATA3 (6Gbps) ports
    7. I/O: 1 VGA, 2 COM, TPM header
    8. 2 SuperDOM with built-in power
    9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
    10. M.2 NGFF connector
      M.2 Interface: PCI-E 3.0 x4 and SATA
      Form Factor: 2280, 22110
      Key: M-Key
      Double Height Connector