- Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
- Intel® C622
- Up to 3TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 3TB 3DS ECC LRDIMM, in 24 DIMM slots
4 PCI-E 3.0 x24 slots to PCI-E board M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s)
- 1 VGA port
- Intel® C622 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- Dual LAN with 10Gbase-T
from C622
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