- 3D Rendering - Astrophysics, Chemistry - Cloud and Virtualization needs - Cloud Computing - Compute Intensive Application 1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 8 PCI-E 3.0 x16 slots (support up to 8 double width GPU), 2 PCI-E 3.0 x8, 1 PCI-E 2.0 x4 4. Up to 24 Hot-swap 2.5" drive bays; 10x 2.5" drives supported natively, 1 NVMe based M.2 SSD 5. 2x 10GBase-T LAN ports via Intel C622 6. 8 Hot-swap 92mm RPM cooling fans 7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+) |